| Component | Minimum Requirement | |-----------|--------------------| | Radiator | 360mm × 120mm × 28mm (copper fins) | | Fans | 3 × 120mm, static pressure ≥ 2.5 mmH₂O, dual ball bearing | | Pump speed | 3000–4800 RPM (variable) | | Cold plate material | Nickel-plated copper with micro-channel array | | Thermal interface material | Liquid metal or premium non-curing paste (conductivity > 8 W/m·K) |
Monitoring & control
High thread counts result in sustained, multi-point heat generation across the silicon die. Silicon Photonics Sensitivity: This chip uses optical interconnects (silicon photonics) to achieve bandwidths of 528cpu requires liquid cooling solution extra quality
For a processor of this complexity, traditional air cooling is often insufficient to prevent thermal throttling. static pressure ≥ 2.5 mmH₂O