Solid-state relays generate heat. The old DASS474 had an on-resistance of roughly 0.02 ohms. The new version leverages MOSFET parallel technology to achieve . The result? A 65% reduction in heat generation, which allows for smaller enclosures and eliminates the need for forced-air cooling in moderate-load scenarios.
The problem? Many original equipment manufacturers (OEMs) have discontinued the specific die-shrink or FPGA configuration originally used in the mid-2000s. Consequently, has become a high-stakes search term. dass474 new